Method of processing a substrate and apparatus processing the same
US7976896B2 · kind B2 · utility
5Cited by
1References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2006 |
| Grant date | Jul 12, 2011 |
| Priority date | — |
| Expiry date | Sep 28, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A spin chuck rotatably holds a semiconductor wafer, while resist is dropped on a surface of the semiconductor wafer through a resist application nozzle and thus applied thereon, and before the resist applied on the wafer dries, a cleaning liquid is supplied through a bevel cleaning nozzle to a portion of the wafer located at a peripheral portion thereof in a vicinity of a beveled portion to remove the resist adhering to the beveled portion. Thereafter, a film of the resist that is formed on the surface of the wafer is dried.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.