Multiple flip-chip integrated circuit package system
US7977579B2 · kind B2 · utility
36Cited by
20References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2006 |
| Grant date | Jul 12, 2011 |
| Priority date | — |
| Expiry date | Apr 11, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package system includes forming a multi-tier substrate, and attaching a plurality of integrated circuits on the multi-tier substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.