Chemical-mechanical planarization pad having end point detection window
US7985121B2 · kind B2 · utility
2Cited by
24References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2008 |
| Grant date | Jul 26, 2011 |
| Priority date | — |
| Expiry date | Jul 1, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C70/467
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polishing pad. The pad includes a surface and a polymer matrix capable of transmitting at least a portion of incident radiation. In addition, at least one embedded structure in the polymer matrix, including a portion of the pad where the embedded structure is not present, and a window integral to the pad defined by the portion of the pad where the embedded structure is not present.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.