Wire bond interconnection
US7986047B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 2010 |
| Grant date | Jul 26, 2011 |
| Priority date | — |
| Expiry date | May 19, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1517
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire bond interconnection between a die pad and a bond finger includes a support pedestal at a bond site of the lead finger, a ball bond on the die pad, and a stitch bond on the support pedestal, in which a width of the lead finger at the bond site is less than a diameter of the support pedestal. Also, a semiconductor package including a die mounted onto and electrically connected by a plurality of wire bonds to a substrate, in which each of the wire bonds includes a wire ball bonded to a pad on the die and stitch bonded to a support pedestal on a bond site on a lead finger, and in which the width of the lead finger at the bond site is less than the diameter of the support pedestal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.