Jong Kook Kim
23Patents
6h-index
36Co-inventors
69Inventor score
Filing activity: Nov 2, 1990 → Mar 2, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9349713B2 | Semiconductor package stack structure having interposer substrate | Electricity | 54 | Active |
| US7271496B2 | Integrated circuit package-in-package system | Electricity | 21 | Expired |
| US7407080B2 | Wire bond capillary tip | Electricity | 11 | Expired |
| US7453156B2 | Wire bond interconnection | Electricity | 7 | Expired |
| US7429798B2 | Integrated circuit package-in-package system | Electricity | 7 | Active |
| US6040462A | Calix[4 ]arene dibenzo crown ethers, their preparation process and their use for the selective extraction of cesium ion | Chemistry; Metallurgy | 7 | Expired |
| US5157450A | Apparatus for reversely turning copied sheets for a copying machine | Performing Operations; Transporting | 6 | Expired |
| US9129826B2 | Epoxy bump for overhang die | Electricity | 4 | Active |
| US7254757B2 | Flash memory test system and method capable of test time reduction | Physics | 4 | Expired |
| US7731078B2 | Semiconductor system with fine pitch lead fingers | Electricity | 4 | Expired |
| US7909233B2 | Method of manufacturing a semiconductor package with fine pitch lead fingers | Electricity | 3 | Active |
| US7745322B2 | Wire bond interconnection | Electricity | 3 | Active |
| US6637970B1 | Connector for prefabricated structures | Emerging Cross-Sectional Technologies | 3 | Expired |
| US7928435B2 | Interposer chip and multi-chip package having the interposer chip | Electricity | 2 | Active |
| US8129263B2 | Wire bond interconnection and method of manufacture thereof | Electricity | 1 | Active |
| US7986047B2 | Wire bond interconnection | Electricity | 1 | Active |
| US11063346B2 | Shark fin antenna for vehicle | Electricity | 1 | Active |
| US10391518B2 | Method for manufacturing transparent pattern print steel plate | Performing Operations; Transporting | 0 | Active |
| US8519517B2 | Semiconductor system with fine pitch lead fingers and method of manufacturing thereof | Electricity | 0 | Active |
| US10056321B2 | Semiconductor package and method for routing the package | Electricity | 0 | Active |
| US7298052B2 | Micro chip-scale-package system | Electricity | 0 | Expired |
| US8256660B2 | Semiconductor package system with fine pitch lead fingers and method of manufacturing thereof | Electricity | 0 | Active |
| US7652382B2 | Micro chip-scale-package system | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.