Package-on-package system with through vias and method of manufacture thereof
US7986048B2 · kind B2 · utility
5Cited by
11References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2009 |
| Grant date | Jul 26, 2011 |
| Priority date | — |
| Expiry date | Nov 26, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of a package-on-package system includes: providing a package substrate; attaching a semiconductor die to the package substrate; forming an encapsulant around the semiconductor die to have a bottom exposed surface coplanar with a bottom surface of the package substrate and to have a top exposed surface with through openings extending therefrom through the bottom exposed surface; and creating through vias by applying solder into the through openings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.