Lower liner with integrated flow equalizer and improved conductance
US7987814B2 · kind B2 · utility
18Cited by
19References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2008 |
| Grant date | Aug 2, 2011 |
| Priority date | — |
| Expiry date | Jul 5, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/13
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma processing chamber has a lower liner with an integrated flow equalizer. In an etching process, the processing gases may be unevenly drawn from the processing chamber which may cause an uneven etching of the substrate. The integrated flow equalizer is configured to equalize the flow of the processing gases evacuated from the chamber via the lower liner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.