Test pattern structure
US7989804B2 · kind B2 · utility
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1References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2009 |
| Grant date | Aug 2, 2011 |
| Priority date | — |
| Expiry date | Jun 4, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24826
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A test pattern structure including a first conductive layer and a second conductive layer is provided. The second conductive layer is directly disposed on the first conductive layer and connected to the first conductive layer through a plurality of connection interfaces. The test pattern structure of the present invention can detect the interconnection failure quickly and correctly without SEM identification.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.