Da Yang
25Patents
3h-index
37Co-inventors
59Inventor score
Filing activity: Mar 4, 2009 → Jun 8, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9871121B2 | Semiconductor device having a gap defined therein | Electricity | 22 | Active |
| US9799560B2 | Self-aligned structure | Electricity | 13 | Active |
| US9953979B2 | Contact wrap around structure | Electricity | 7 | Active |
| US9653399B2 | Middle-of-line integration methods and semiconductor devices | Electricity | 3 | Active |
| US10497702B2 | Metal-oxide semiconductor (MOS) standard cells employing electrically coupled source regions and supply rails to relax source-drain tip-to-tip spacing between adjacent MOS standard cells | Electricity | 3 | Active |
| US10043796B2 | Vertically stacked nanowire field effect transistors | Electricity | 3 | Active |
| US9985014B2 | Minimum track standard cell circuits for reduced area | Electricity | 3 | Active |
| US9620454B2 | Middle-of-line (MOL) manufactured integrated circuits (ICs) employing local interconnects of metal lines using an elongated via, and related methods | Electricity | 2 | Active |
| US9397007B2 | Method for manufacturing semiconductor structure through forming an additional layer inside opening of a photoresist layer | Electricity | 2 | Active |
| US10090244B2 | Standard cell circuits employing high aspect ratio voltage rails for reduced resistance | Electricity | 2 | Active |
| US8669160B2 | Method for manufacturing a semiconductor device | Electricity | 1 | Active |
| US10032678B2 | Nanowire channel structures of continuously stacked nanowires for complementary metal oxide semiconductor (CMOS) devices | Electricity | 1 | Active |
| US8420492B2 | MOS transistor and method for forming the same | Electricity | 1 | Active |
| US9263279B2 | Combining cut mask lithography and conventional lithography to achieve sub-threshold pattern features | Electricity | 1 | Active |
| US10079293B2 | Semiconductor device having a gap defined therein | Electricity | 1 | Active |
| US9997360B2 | Method for mitigating layout effect in FINFET | Electricity | 1 | Active |
| US9502283B2 | Electron-beam (E-beam) based semiconductor device features | Electricity | 0 | Active |
| US9245971B2 | Semiconductor device having high mobility channel | Electricity | 0 | Active |
| US10763364B1 | Circuits having a diffusion break with avoided or reduced adjacent semiconductor channel strain relaxation, and related methods | Electricity | 0 | Active |
| US9859210B2 | Integrated circuits having reduced dimensions between components | Electricity | 0 | Active |
| US10181403B2 | Layout effect mitigation in FinFET | Electricity | 0 | Active |
| US7989804B2 | Test pattern structure | Emerging Cross-Sectional Technologies | 0 | Active |
| US11152347B2 | Cell circuits formed in circuit cells employing offset gate cut areas in a non-active area for routing transistor gate cross-connections | Electricity | 0 | Active |
| US10700204B2 | Circuits having a diffusion break with avoided or reduced adjacent semiconductor channel strain relaxation, and related methods | Electricity | 0 | Active |
| US10559501B2 | Self-aligned quadruple patterning process for Fin pitch below 20nm | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.