Patent · US Active

Semiconductor package

US7989930B2 · kind B2 · utility

0Cited by

5References

22Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Edmund Riedl · Bergneustadt, DE
Joachim Mahler · Regensburg, DE
Johannes Lodermeyer · Kinding, DE
Mathias Vaupel · Regensburg, DE
Steffen Jordan · Viehhausen, DE

Key dates

Filing date	Oct 25, 2007
Grant date	Aug 2, 2011
Priority date	—
Expiry date	Aug 4, 2028

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor package includes a leadframe defining a die pad, a chip electrically coupled to the die pad, encapsulation material covering the chip and the die pad, and a plurality of lead ends exposed relative to the encapsulation material and configured for electrical communication with the chip, and a nitrogen-containing hydrocarbon coating disposed over at least the lead ends of the leadframe, where the hydrocarbon coating is free of metal particles.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.