Integrated circuit package system with support structure for die overhang
US7989941B2 · kind B2 · utility
6Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2008 |
| Grant date | Aug 2, 2011 |
| Priority date | — |
| Expiry date | Mar 19, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package system including: providing a substrate having a support mounted thereover; mounting an integrated circuit die above the substrate; mounting a wire-bonded die offset above the integrated circuit die creating an overhang supported by the support; connecting the wire-bonded die to the substrate with bond wires; and encapsulating the integrated circuit die, the wire-bonded die and the bond wires with an encapsulation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.