Patent · US Active

Power management with packaged multi-die integrated circuit

US7992020B1 · kind B1 · utility

12Cited by

3References

20Claims

0Family size

Assignee

XILINX, INC. · US

Inventors

Tim Tuan · San Jose, US
Kerry M. Pierce · Canby, US
Albert Franceschino · Yardley, US

Key dates

Filing date	Mar 5, 2008
Grant date	Aug 2, 2011
Priority date	—
Expiry date	Jan 1, 2030

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02D10/00
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

Power management with a packaged multi-die integrated circuit (IC) is described. A first integrated circuit die is capable of a first operational mode. A second integrated circuit die is coupled to the first integrated circuit die. The first integrated circuit die has a rate of power consumption that is lower than the second integrated circuit die when the first integrated circuit die is in the first operational mode and the second integrated circuit die is in a second operational mode. The first integrated circuit die is configured for power management of the second integrated circuit die for placing the second integrated circuit die in a standby mode from the second operational mode and for returning the second integrated circuit die to the second operational mode from the standby mode.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.