Magnetically alignable integrated circuit device
US7994608B2 · kind B2 · utility
10Cited by
5References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2005 |
| Grant date | Aug 9, 2011 |
| Priority date | — |
| Expiry date | Apr 6, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit device includes a semiconductor chip having an active surface with a plurality of chip contact pads, a rewiring substrate and an electrically conductive inductor coil for magnetically aligning the semiconductor chip with the rewiring substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.