Method and apparatus for securely dechucking wafers
US7995323B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 14, 2008 |
| Grant date | Aug 9, 2011 |
| Priority date | — |
| Expiry date | Jun 1, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6833
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer stage installed in a process chamber for safely dechucking a wafer is provided. In one embodiment, the wafer stage comprises: a chuck support for supporting a chuck; a chuck mounted on the chuck support for receiving and attaching a wafer thereto; a support lift means for supporting the wafer; a driving means coupled to the support lift means for gradually raising the support lift means to contact the wafer in response to a variable quantity; a controller for receiving the variable quantity; and a regulating means coupled to the driving means and to the controller, the regulating means for controlling the variable quantity going to the driving means when a predetermined variable quantity is detected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.