Method for producing III-N layers, and III-N layers or III-N substrates, and devices based thereon
US7998273B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 5, 2006 |
| Grant date | Aug 16, 2011 |
| Priority date | — |
| Expiry date | Jul 10, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24355
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An epitaxial growth process for producing a thick III-N layer, wherein III denotes at least one element of group III of the periodic table of elements, is disclosed, wherein a thick III-N layer is deposited above a foreign substrate. The epitaxial growth process preferably is carried out by HVPE. The substrate can also be a template comprising the foreign substrate and at least one thin III-N intermediate layer. The surface quality is improved by providing a slight intentional misorientation of the substrate, and/or a reduction of the N/III ratio and/or the reactor pressure towards the end of the epitaxial growth process. Substrates and semiconductor devices with such improved III-N layers are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.