Electron beam enhanced surface wave plasma source
US7998307B2 · kind B2 · utility
8Cited by
6References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2006 |
| Grant date | Aug 16, 2011 |
| Priority date | — |
| Expiry date | Jun 4, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3233
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma processing system is described for generating plasma with a ballistic electron beam using a surface wave plasma (SWP) source, such as a radial line slot antenna (RLSA) during semiconductor device fabrication. The antenna comprises a resonator plate having a partially open, electrically conductive layer coupled to a surface of the resonator plate. For example, the electrically conductive layer is formed at an interface between the resonator plate and the plasma, and a direct current (DC) voltage is applied to the electrically conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.