Peak-based endpointing for chemical mechanical polishing
US7998358B2 · kind B2 · utility
12Cited by
39References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2006 |
| Grant date | Aug 16, 2011 |
| Priority date | — |
| Expiry date | Feb 17, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing system receives one or more target parameters for a selected peak in a spectrum of light, polishes a substrate, measures a current spectrum of light reflected from the substrate while the substrate is being polished, identifies the selected peak in the current spectrum, measures one or more current parameters of the selected peak in the current spectrum, compares the current parameters of the selected peak to the target parameters, and ceases to polish the substrate when the current parameters and the target parameters have a pre defined relationship.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.