Dual sided electronic module
US7999197B1 · kind B1 · utility
4Cited by
13References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2009 |
| Grant date | Aug 16, 2011 |
| Priority date | — |
| Expiry date | Feb 12, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for making a dual sided electronic module. A substrate has a first surface that is substantially parallel to a second surface. The second surface forms a cavity extending into an interior portion of the substrate. The substrate has at least one through hole connecting the cavity to the first surface. A first component is mounted with respect to the first surface, and a second component is mounted at least partially within the cavity. An encapsulant is applied to the first surface and through the at least one through hole into the cavity about the second component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.