Patent · US Active

Method and apparatus for making semiconductor devices including a foil

US7999362B2 · kind B2 · utility

0Cited by

5References

12Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Hannes Mio · Taufkirchen, DE
Horst Groeninger · Maxhütte-Haidhof, DE
Hermann Vilsmeier · Regensburg, DE

Key dates

Filing date	Jan 25, 2008
Grant date	Aug 16, 2011
Priority date	—
Expiry date	Dec 3, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19042
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for manufacturing a semiconductor device including covering a portion of at least one semiconductor device with a foil, including covering at least one target region of the semiconductor device, and illuminating the foil with a laser to singulate from the foil a portion covering the at least one target region of the at least one semiconductor device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.