Method of making a semiconductor chip assembly with a post/base heat spreader and vertical signal routing
US8003415B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2009 |
| Grant date | Aug 23, 2011 |
| Priority date | — |
| Expiry date | Oct 24, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8582
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an aperture in the substrate to form a gap in the aperture between the post and the substrate, then flowing the adhesive into and upward in the gap, solidifying the adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader. The substrate includes first and second conductive layers and a dielectric layer therebetween, and the assembly provides the vertical signal routing between a pad at the first conductive layer and a terminal below the adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.