Patent · US Active

Integrated circuit package system with bump pad

US8008770B2 · kind B2 · utility

22Cited by
4References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 2, 2006
Grant dateAug 30, 2011
Priority date—
Expiry dateOct 14, 2027

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/14
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

An integrated circuit package system includes an integrated circuit, and forming a patterned redistribution pad over the integrated circuit.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.