Wan Lay Looi
5Patents
2h-index
10Co-inventors
37Inventor score
Filing activity: May 13, 2004 → Nov 2, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8008770B2 | Integrated circuit package system with bump pad | Electricity | 22 | Active |
| US7443039B2 | System for different bond pads in an integrated circuit package | Electricity | 2 | Active |
| US7381634B2 | Integrated circuit system for bonding | Electricity | 1 | Expired |
| US7005370B2 | Method of manufacturing different bond pads on the same substrate of an integrated circuit package | Electricity | 0 | Expired |
| US8134196B2 | Integrated circuit system with metal-insulator-metal circuit element | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.