Patent · US Active

Integrated circuit package system with delamination prevention structure

US8008787B2 · kind B2 · utility

1Cited by
12References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 18, 2007
Grant dateAug 30, 2011
Priority date—
Expiry dateDec 26, 2028

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/1815
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

An integrated circuit package system includes: mounting an integrated circuit die over a carrier; attaching a delamination prevention structure over the integrated circuit die; and encapsulating the delamination prevention structure and the integrated circuit die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.