Semiconductor workpiece carriers and methods for processing semiconductor workpieces
US8011513B2 · kind B2 · utility
1Cited by
12References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2007 |
| Grant date | Sep 6, 2011 |
| Priority date | — |
| Expiry date | Oct 21, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/269
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor workpiece carriers and methods for processing semiconductor workpieces are disclosed herein. In one embodiment, a semiconductor workpiece carrier assembly includes (a) a support structure having an opening sized to receive at least a portion of a semiconductor workpiece, and (b) a replaceable carrier positioned at the opening. The replaceable carrier includes a base and an adhesive layer on the base. The base has a surface, and the adhesive layer covers only a section of the surface of the base. The adhesive layer releasably attaches the replaceable carrier to the support structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.