Extended pad life for ECMP and barrier removal
US8012000B2 · kind B2 · utility
1Cited by
59References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2007 |
| Grant date | Sep 6, 2011 |
| Priority date | — |
| Expiry date | Jul 30, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23H5/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for extending a polishing article lifetime on a polishing tool with multiple platens is described. The apparatus includes an advanceable roll to roll platen with multiple embodiments of a polishing article to be used thereon. The polishing article is adapted to perform a polishing process by removing conductive and dielectric material from a substrate while minimizing downtime of the polishing tool. In some embodiments, the polishing article may be a dielectric material or a conductive material and is configured to include a longer usable lifetime to minimize replacement and downtime of the tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.