Patent · US Active

Metal plating compositions and methods

US8012334B2 · kind B2 · utility

8Cited by

5References

3Claims

0Family size

Assignee

Rohm and Haas Electronic Materials LLC · US

Inventors

Erik Reddington · Ashland, US
Gonzalo Urrutia Desmaison · Berlin, DE
Zukhra I. Niazimbetova · Westborough, US
Donald E. Cleary · Littleton, US
Mark Lefebvre · Hudson, US

Key dates

Filing date	Apr 2, 2008
Grant date	Sep 6, 2011
Priority date	—
Expiry date	May 30, 2030

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08G2650/58
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.