Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers

US8012796B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Paul S. Andry · Yorktown Heights, US
• John M. Cotte · New Fairfield, US
• John U. Knickerbocker · Wappingers Falls, US
• Cornelia K. Tsang · Potsdam, US

Key dates

• Filing date: Aug 10, 2009
• Grant date: Sep 6, 2011
• Expiry date: Oct 10, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3025
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Apparatus and methods are provided for high density packaging of semiconductor chips using silicon space transformer chip level package structures, which allow high density chip interconnection and/or integration of multiple chips or chip stacks high I/O interconnection and heterogeneous chip or function integration.