Method for producing an integrated circuit and arrangement comprising a substrate

US8013377B2 · kind B2 · utility

Assignee

• Qimonda AG · DE

Inventors

• Peter Baars · Dresden, DE
• Stefan Tegen · Dresden, DE
• Klaus Muemmler · Dresden, DE

Key dates

• Filing date: Nov 12, 2008
• Grant date: Sep 6, 2011
• Expiry date: Jun 6, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10B12/033

Abstract

Embodiments of the invention relate to an integrated circuit comprising a carrier, having a capacitor with a first electrode and a second electrode. The first electrode has a dielectric layer A layer sequence is arranged on the carrier, the capacitor being introduced in said layer sequence, wherein the layer sequence has a first supporting layer and a second supporting layer arranged at a distance above the first supporting layer, wherein the first and the second supporting layer adjoin the first electrode of the capacitor. Methods of manufacturing the integrated circuit are also provided.