Wafer system with partial cuts
US8017502B2 · kind B2 · utility
2Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2006 |
| Grant date | Sep 13, 2011 |
| Priority date | — |
| Expiry date | Jul 18, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/78
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer system is provided including providing a wafer having a topside and a backside, forming a partial cut from the topside of the wafer within a wafer rim and thinning the wafer from the backside for exposing the partial cut at the backside within the wafer rim.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.