Inventor · Suwon-si, KR

Taewoo Lee

111Patents
7h-index
98Co-inventors
73Inventor score

Filing activity: Sep 15, 2006 → Nov 10, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US8895440B2 Semiconductor die and method of forming Fo-WLCSP vertical interconnect using TSV and TMV Electricity 63 Active
US8502387B2 Integrated circuit packaging system with vertical interconnection and method of manufacture thereof Electricity 45 Active
US8115293B2 Integrated circuit packaging system with interconnect and method of manufacture thereof Electricity 17 Active
US7727875B2 Grooving bumped wafer pre-underfill system Electricity 14 Active
US10424696B2 Wavelength converting particle, method for manufacturing wavelength converting particle, and light emitting diode containing wavelength converting particle Electricity 10 Active
US7863755B2 Package-on-package system with via Z-interconnections Electricity 10 Active
US10811035B1 Heat-assisted magnetic recording head with constant-width gap between near-field transducer and side shield Physics 7 Active
US9153494B2 Semiconductor die and method of forming Fo-WLCSP vertical interconnect using TSV and TMV Electricity 7 Active
US9117812B2 Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability Electricity 6 Active
US8624370B2 Integrated circuit packaging system with an interposer and method of manufacture thereof Electricity 5 Active
US10819911B2 Electronic device for zooming a preview image Physics 5 Active
US8030769B2 Grooving bumped wafer pre-underfill system Electricity 5 Active
US10714137B1 Near-field transducer having a peg surrounded by a metal aperture plate Physics 5 Active
US10263207B2 Perovskite light emitting device containing exciton buffer layer and method for manufacturing same Emerging Cross-Sectional Technologies 4 Active
US8574964B2 Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tape Electricity 4 Active
US8258008B2 Package-on-package system with via z-interconnections and method for manufacturing thereof Electricity 3 Active
US8642384B2 Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability Electricity 3 Active
US10351849B2 Pharmaceutical composition for treating cancer comprising microrna as active ingredient Chemistry; Metallurgy 3 Active
US7786551B2 Integrated circuit system with wafer trimming Electricity 2 Active
US10047284B2 Perovskite nanocrystal particle light-emitter whose content is changed, method of producing the same, and light emitting element using the same Emerging Cross-Sectional Technologies 2 Active
US8017502B2 Wafer system with partial cuts Electricity 2 Active
US11368973B2 Terminal apparatus, base station apparatus, and communication method with beam parameters including quasi co-located antenna port indexes Electricity 2 Active
US11863326B2 Base stations and methods Electricity 2 Active
US12048000B2 User equipment, base station, method for a user equipment, and method for a base station Electricity 2 Active
US8676422B2 Creep control device and method for hybrid vehicle Emerging Cross-Sectional Technologies 2 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.