Scheduling method for processing equipment
US8019467B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2007 |
| Grant date | Sep 13, 2011 |
| Priority date | — |
| Expiry date | Jun 11, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67276
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput and repeatable wafer processing history are provided. In one embodiment a first substrate is transferred from a first position to a second position and then the first substrate is transferred from the second position to a third position using a first robot. A second substrate is transferred from a first position to a second position and then the second substrate is transferred from the second position to a third position using a second robot. The movement of the first and second robots is synchronized so that the movement from the first position to the second position by the first and second robot is performed within a first time interval.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.