Patent · US Active

Process chamber component with layered coating and method

US8021743B2 · kind B2 · utility

10Cited by

75References

36Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Yixing Lin · Saratoga, US
Daijiang Xu · Milpitas, US
Clifford Stow · Ramona, US

Key dates

Filing date	Aug 24, 2009
Grant date	Sep 20, 2011
Priority date	—
Expiry date	Aug 24, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31504
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A substrate processing chamber component is capable of being exposed to an energized gas in a process chamber. The component has an underlying structure and first and second coating layers, the first coating layer comprising a first material having a first thermal expansion coefficient and a first surface having an average surface roughness of less than about 25 micrometers. The second coating layer is over the first surface of the first coating layer, the second coating layer comprising a second material having a second thermal expansion coefficient that differs by less than 5% from the first thermal expansion coefficient of the first material and a second surface having an average surface roughness of at least about 50 micrometers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.