Redistribution layers for microfeature workpieces, and associated systems and methods
US8021981B2 · kind B2 · utility
4Cited by
17References
32Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 30, 2006 |
| Grant date | Sep 20, 2011 |
| Priority date | — |
| Expiry date | Jul 13, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06548
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Redistribution layers for microfeature workpieces, and associated systems and methods are disclosed. One method for processing a microfeature workpiece system includes positioning a preformed redistribution layer as a unit proximate to and spaced apart from a microfeature workpiece having an operable microfeature device. The method can further include attaching the redistribution layer to the microfeature workpiece and electrically coupling the redistribution layer to the operable microfeature device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.