Base package system for integrated circuit package stacking and method of manufacture thereof
US8022538B2 · kind B2 · utility
0Cited by
27References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2008 |
| Grant date | Sep 20, 2011 |
| Priority date | — |
| Expiry date | May 10, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of a base package system includes: forming a substrate strip assembly including: providing a substrate strip having ball lands, mounting an integrated circuit on the substrate strip, and molding a finger structure, having a knuckle region, on the integrated circuit; and singulating a substrate from the substrate strip assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.