WonJun Ko
17Patents
5h-index
22Co-inventors
58Inventor score
Filing activity: Mar 16, 2007 → Sep 25, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8263435B2 | Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias | Electricity | 43 | Active |
| US8035211B2 | Integrated circuit package system with support structure under wire-in-film adhesive | Electricity | 12 | Active |
| US8536718B2 | Integrated circuit packaging system with trenches and method of manufacture thereof | Electricity | 10 | Active |
| US8609463B2 | Integrated circuit package system employing multi-package module techniques | Electricity | 6 | Active |
| US8569882B2 | Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof | Electricity | 5 | Active |
| US9252032B2 | Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias | Electricity | 5 | Active |
| US9076802B1 | Dual-sided film-assist molding process | Electricity | 4 | Active |
| US8227925B2 | Integrated circuit packaging system with interposer | Emerging Cross-Sectional Technologies | 3 | Active |
| US10163744B2 | Semiconductor device and method of forming a low profile dual-purpose shield and heat-dissipation structure | Electricity | 3 | Active |
| US8524537B2 | Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue | Electricity | 3 | Active |
| US8546957B2 | Integrated circuit packaging system with dielectric support and method of manufacture thereof | Electricity | 3 | Active |
| US8124451B2 | Integrated circuit packaging system with interposer | Emerging Cross-Sectional Technologies | 2 | Active |
| US8618653B2 | Integrated circuit package system with wafer scale heat slug | Electricity | 1 | Active |
| US9279673B2 | Semiconductor device and method of calibrating warpage testing system to accurately measure semiconductor package warpage | Electricity | 1 | Active |
| US8022538B2 | Base package system for integrated circuit package stacking and method of manufacture thereof | Electricity | 0 | Active |
| US8415204B2 | Integrated circuit packaging system with heat spreader and method of manufacture thereof | Electricity | 0 | Active |
| US8067275B2 | Integrated circuit package system with package integration | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.