Device for polishing peripheral edge of semiconductor wafer
US8029333B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 17, 2007 |
| Grant date | Oct 4, 2011 |
| Priority date | — |
| Expiry date | Nov 6, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B21/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the wafer stage to undergo a rotary reciprocating motion within the same plane as the surface of the wafer stage, and moving the wafer stage parallel to the surface, a notch polishing part for polishing the notch on the wafer and a bevel polishing part for polishing the beveled part of the wafer. Pure water is supplied to the wafer to prevent it from becoming dry as it is transported from the notch polishing part to the bevel polishing part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.