Device and method for liquid treatment of wafer-shaped articles
US8029641B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 2006 |
| Grant date | Oct 4, 2011 |
| Priority date | — |
| Expiry date | Sep 8, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6708
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Method and device for wet treating a defined peripheral edge-region of a wafer-shaped article having a first surface plane W1, a second surface plane W2 and an edge surface. The device includes a support for holding the wafer-shaped article; liquid dispensing members for dispensing liquid onto the first surface plane W1 of the wafer-shaped article not facing the support and liquid guiding member connected to the support for guiding at least a part of the liquid around the edge surface of the wafer-shaped article towards the second surface plane W2 of the wafer-shaped article facing the support thereby wetting at least the edge surface, wherein the liquid guiding member has the form of a ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.