Patent · US Active

Semiconductor module

US8030131B2 · kind B2 · utility

16Cited by

13References

13Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Ralf Otremba · Kaufbeuren, DE
Xaver Schloegel · Sachsenkam, DE
Klaus Schiess · Allensbach, DE
Tien Lai Tan · Melaka City, MY

Key dates

Filing date	Mar 12, 2009
Grant date	Oct 4, 2011
Priority date	—
Expiry date	Jul 8, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15165
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A module having a semiconductor chip with a first contact element on a first main surface and a second contact element on a second main surface is disclosed. The semiconductor chip is arranged on a carrier. An insulating layer and a wiring layer cover the second main surface and the carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.