Patent · US Active

Electronic device

US8030741B2 · kind B2 · utility

2Cited by

12References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thomas Bemmerl · Schwandorf, DE
Thomas Mende · Goldkronach, DE
Bernd Rakow · Regensburg, DE

Key dates

Filing date	May 5, 2010
Grant date	Oct 4, 2011
Priority date	—
Expiry date	May 5, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

One embodiment provides a semiconductor assembly including a printed circuit board and a semiconductor package. The semiconductor package includes a lead frame having a die pad and a plurality of leads spaced from the die pad, a chip attached to the die pad on a front face of the lead frame, at least one electrically conductive structure element mechanically coupled to but electrically isolated from the front face of the lead frame, at least one connector electrically connecting the chip to the structure element, at least one connector electrically connecting the structure element to at least one of the leads, and a mold material encasing the semiconductor package except for an end portion of the leads which are electrically connected to the printed circuit board.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.