Grooving bumped wafer pre-underfill system
US8030769B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2010 |
| Grant date | Oct 4, 2011 |
| Priority date | — |
| Expiry date | Apr 20, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming a semiconductor device includes providing a bumped wafer. A plurality of grooves is formed in an active surface of the bumped wafer. A pre-underfill layer is disposed over the active surface, filling the plurality of grooves. A first adhesive layer is mounted to the pre-underfill layer, and a back surface of the bumped wafer is ground. A second adhesive layer is mounted to the back surface of the bumped wafer. The first adhesive layer is peeled from the active surface of the bumped wafer, or the second adhesive layer is mounted to the first adhesive layer. The bumped wafer is singulated into a plurality of segments by cutting the bumped wafer along the plurality of grooves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.