Minimum contact area wafer clamping with gas flow for rapid wafer cooling
US8033771B1 · kind B1 · utility
474Cited by
44References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2008 |
| Grant date | Oct 11, 2011 |
| Priority date | — |
| Expiry date | Oct 26, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/135
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatuses and methods for cooling and transferring wafers from low pressure environment to high pressure environment are provided. An apparatus may include a cooling pedestal and a set of supports for holding the wafer above the cooling pedestal. The average gap between the wafer and the cooling pedestal may be no greater than about 0.010 inches. Venting gases may be used to increase the pressure inside the apparatus during the transfer. In certain embodiment, venting gases comprise nitrogen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.