Semiconductor component and method of manufacture
US8034685B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2010 |
| Grant date | Oct 11, 2011 |
| Priority date | — |
| Expiry date | Apr 30, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/663
Abstract
A semiconductor component that includes gate electrodes and shield electrodes and a method of manufacturing the semiconductor component. A semiconductor material has a device region, a gate contact region, a termination region, and a drain contact region. One or more device trenches is formed in the device region and one or more termination trenches is formed in the edge termination region. Shield electrodes are formed in portions of the device trenches that are adjacent their floors. A gate dielectric material is formed on the sidewalls of the trenches in the device region and gate electrodes are formed over and electrically isolated from the shield electrodes. A gate electrode in at least one of the trenches is connected to at least one shield electrode in the trenches.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.