Integrated circuit package system with interposer
US8035210B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2007 |
| Grant date | Oct 11, 2011 |
| Priority date | — |
| Expiry date | Mar 2, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an integrated circuit package system includes: providing a base substrate; coupling a base integrated circuit on the base substrate; forming a double side molded interposer unit over the base integrated circuit including: providing an interposer substrate having an interposer top and an interposer bottom, mounting a first integrated circuit to the interposer bottom and electrically connected thereto, mounting a second integrated circuit to the interposer top and electrically connected thereto, and molding a first chip cover on the first integrated circuit and a second chip cover on the second integrated circuit; and coupling an external component to the double side molded interposer unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.