Integrated circuit package system with support structure under wire-in-film adhesive
US8035211B2 · kind B2 · utility
12Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2008 |
| Grant date | Oct 11, 2011 |
| Priority date | — |
| Expiry date | Aug 2, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package in package system including: providing a substrate; mounting a wire bonded die with an active side over the substrate; connecting the active side to the substrate with bond wires; mounting a structure over the wire bonded die having a wire-in-film adhesive between the structure and the wire bonded die and overhangs at ends of the structure between the wire-in-film adhesive and the substrate; mounting support structures at the overhangs between the wire-in-film adhesive and the substrate; and encapsulating the wire bonded die and the structure with an encapsulation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.