Integrated circuit packaging system with stacked integrated circuit and heat spreader with openings and method of manufacture thereof
US8039316B2 · kind B2 · utility
47Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2009 |
| Grant date | Oct 18, 2011 |
| Priority date | — |
| Expiry date | Jan 23, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture an integrated circuit packaging system includes: providing a substrate; attaching a first integrated circuit to the substrate by interconnects only along opposite sides of the first integrated circuit; and attaching a heat spreader to the substrate, the heat spreader extending over the first integrated circuit and between the opposite sides of the first integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.