Printed circuit board and method thereof and a solder ball land and method thereof
US8039972B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2009 |
| Grant date | Oct 18, 2011 |
| Priority date | — |
| Expiry date | Oct 25, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0989
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A printed circuit board and method thereof and a solder ball land and method thereof. The example printed circuit board (PCB) may include a first solder ball land having a first surface treatment portion configured for a first type of resistance and a second solder ball land having a second surface treatment portion configured for a second type of resistance. The example solder ball land may include a first surface treatment portion configured for a first type of resistance and a second surface treatment portion configured for a second type of resistance. A first example method may include first treating a first surface of a first solder ball land to increase a first type of resistance and second treating a second surface of a second solder ball land to increase a second type of resistance other than the first type of resistance. A second example method may include first treating a solder ball land to increase a first type of resistance and second treating the solder ball land to increase a second type of resistance other than the first type of resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.