Patent · US Active

Low thermal mass semiconductor wafer support

US8042697B2 · kind B2 · utility

8Cited by

24References

19Claims

0Family size

Assignee

MEMC Electronic Materials, Inc. · US

Inventors

Brian Lawrence Gilmore · O'Fallon, US
Lance G. Hellwig · Florissant, US

Key dates

Filing date	Jun 30, 2008
Grant date	Oct 25, 2011
Priority date	—
Expiry date	Jul 28, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/67309
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A support for a semiconductor wafer includes a plate having a support surface for supporting the wafer and a recessed surface spaced from the support surface and spaced from the wafer. A plurality of holes extends from the recessed surface, and the support surface is free of holes to inhibit contamination of the wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.