High efficiency electro-static chucks for semiconductor wafer processing
US8043433B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 11, 2008 |
| Grant date | Oct 25, 2011 |
| Priority date | — |
| Expiry date | Mar 18, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention generally provides a high efficiency electrostatic chuck for holding a substrate in a processing volume. The high efficiency electrostatic chuck includes an electrode embedded within a high-purity, thermoplastic member. In particular, the high-purity, thermoplastic member may include a high-purity, polyaryletherketone having an extremely low level of metallic ions present therein. The high-purity, polyaryletherketone has excellent wear resistance, high temperature resistance, plasma resistance, corrosive chemical resistance, electrical stability, and strength as compared to polyimide films used in electrostatic chucks. The present invention also provides a simplified method of manufacturing the high efficiency electrostatic chuck.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.