Light emitting diode package structure
US8044420B2 · kind B2 · utility
6Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2009 |
| Grant date | Oct 25, 2011 |
| Priority date | — |
| Expiry date | Mar 8, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/97
Abstract
The present invention relates to a method for forming a package structure for a light emitting diode (LED) and the LED package structure thereof. By employing the same sawing process to cut through the trenches of the leadframe, the package units are singulated and different lead portions are simultaneously separated from each other in each package unit. Therefore, the overflow issues of the encapsulant can be avoided without using extra taping process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.