SeonGoo Lee
9Patents
6h-index
8Co-inventors
52Inventor score
Filing activity: May 19, 2000 → May 11, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6395578B1 | Semiconductor package and method for fabricating the same | Electricity | 311 | Expired |
| US6762078B2 | Semiconductor package having semiconductor chip within central aperture of substrate | Electricity | 126 | Expired |
| US6501184B1 | Semiconductor package and method for manufacturing the same | Electricity | 38 | Expired |
| US7061120B2 | Stackable semiconductor package having semiconductor chip within central through hole of substrate | Electricity | 17 | Expired |
| US6830955B2 | Semiconductor package and method for manufacturing the same | Electricity | 13 | Expired |
| US6512288B1 | Circuit board semiconductor package | Electricity | 7 | Expired |
| US8044420B2 | Light emitting diode package structure | Electricity | 6 | Active |
| US8330178B2 | Package structure and package process of light emitting diode | Electricity | 1 | Active |
| US8450770B2 | Light emitting package structure | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.